A multilevel analytical placement for 3D ICs.
https://doi.org/10.1109/ASPDAC.2009.4796507
@inproceedings{DBLP:conf/aspdac/CongL09,
author = {Jason Cong and
Guojie Luo},
editor = {Kazutoshi Wakabayashi},
title = {A multilevel analytical placement for 3D ICs},
booktitle = {Proceedings of the 14th Asia South Pacific Design Automation Conference,
{ASP-DAC} 2009, Yokohama, Japan, January 19-22, 2009},
pages = {361--366},
publisher = {{IEEE}},
year = {2009},
url = {https://doi.org/10.1109/ASPDAC.2009.4796507},
doi = {10.1109/ASPDAC.2009.4796507},
timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
biburl = {https://dblp.org/rec/conf/aspdac/CongL09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
本页面没有标签