Thermal-Aware 3D IC Placement Via Transformation.
https://doi.org/10.1109/ASPDAC.2007.358084
@inproceedings{DBLP:conf/aspdac/CongLWZ07,
author = {Jason Cong and
Guojie Luo and
Jie Wei and
Yan Zhang},
title = {Thermal-Aware 3D {IC} Placement Via Transformation},
booktitle = {Proceedings of the 12th Conference on Asia South Pacific Design Automation,
{ASP-DAC} 2007, Yokohama, Japan, January 23-26, 2007},
pages = {780--785},
publisher = {{IEEE} Computer Society},
year = {2007},
url = {https://doi.org/10.1109/ASPDAC.2007.358084},
doi = {10.1109/ASPDAC.2007.358084},
timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
biburl = {https://dblp.org/rec/conf/aspdac/CongLWZ07.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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