Thermal-aware cell and through-silicon-via co-placement for 3D ICs.
https://doi.org/10.1145/2024724.2024876
@inproceedings{DBLP:conf/dac/CongLS11,
author = {Jason Cong and
Guojie Luo and
Yiyu Shi},
editor = {Leon Stok and
Nikil D. Dutt and
Soha Hassoun},
title = {Thermal-aware cell and through-silicon-via co-placement for 3D ICs},
booktitle = {Proceedings of the 48th Design Automation Conference, {DAC} 2011,
San Diego, California, USA, June 5-10, 2011},
pages = {670--675},
publisher = {{ACM}},
year = {2011},
url = {https://doi.org/10.1145/2024724.2024876},
doi = {10.1145/2024724.2024876},
timestamp = {Tue, 06 Nov 2018 16:58:16 +0100},
biburl = {https://dblp.org/rec/conf/dac/CongLS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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