FF-bond: multi-bit flip-flop bonding at placement.
https://doi.org/10.1145/2451916.2451955
@inproceedings{DBLP:conf/ispd/TsaiSLJ13,
author = {Chang{-}Cheng Tsai and
Yiyu Shi and
Guojie Luo and
Iris Hui{-}Ru Jiang},
editor = {Cheng{-}Kok Koh and
Cliff C. N. Sze},
title = {FF-bond: multi-bit flip-flop bonding at placement},
booktitle = {International Symposium on Physical Design, ISPD'13, Stateline, NV,
USA, March 24-27, 2013},
pages = {147--153},
publisher = {{ACM}},
year = {2013},
url = {https://doi.org/10.1145/2451916.2451955},
doi = {10.1145/2451916.2451955},
timestamp = {Tue, 06 Nov 2018 11:07:47 +0100},
biburl = {https://dblp.org/rec/conf/ispd/TsaiSLJ13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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