An artificial neural network approach for wafer dicing saw quality prediction.
https://doi.org/10.1016/j.microrel.2018.10.013
@article{DBLP:journals/mr/SuCCC18,
author = {Te{-}Jen Su and
Yi{-}Feng Chen and
Jui{-}Chuan Cheng and
Chien{-}Liang Chiu},
title = {An artificial neural network approach for wafer dicing saw quality
prediction},
journal = {Microelectron. Reliab.},
volume = {91},
pages = {257--261},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.10.013},
doi = {10.1016/j.microrel.2018.10.013},
timestamp = {Sat, 22 Feb 2020 19:29:19 +0100},
biburl = {https://dblp.org/rec/journals/mr/SuCCC18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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