SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging.
https://doi.org/10.1016/j.microrel.2011.02.011
@article{DBLP:journals/mr/WangLRZM11,
author = {Xi{-}Shu Wang and
Xu{-}Dong Li and
Huai{-}Hui Ren and
Hai{-}Yan Zhao and
Ryosuke Murai},
title = {{SEM} in situ study on high cyclic fatigue of SnPb-solder joint in
the electronic packaging},
journal = {Microelectron. Reliab.},
volume = {51},
number = {8},
pages = {1377--1384},
year = {2011},
url = {https://doi.org/10.1016/j.microrel.2011.02.011},
doi = {10.1016/j.microrel.2011.02.011},
timestamp = {Sat, 22 Feb 2020 19:26:46 +0100},
biburl = {https://dblp.org/rec/journals/mr/WangLRZM11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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