An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness.
https://doi.org/10.1109/TCAD.2012.2232708
@article{DBLP:journals/tcad/LuoSC13,
author = {Guojie Luo and
Yiyu Shi and
Jason Cong},
title = {An Analytical Placement Framework for 3-D ICs and Its Extension on
Thermal Awareness},
journal = {{IEEE} Trans. on {CAD} of Integrated Circuits and Systems},
volume = {32},
number = {4},
pages = {510--523},
year = {2013},
url = {https://doi.org/10.1109/TCAD.2012.2232708},
doi = {10.1109/TCAD.2012.2232708},
timestamp = {Sat, 20 May 2017 00:23:49 +0200},
biburl = {https://dblp.org/rec/journals/tcad/LuoSC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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